The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 17, 2005

Filed:

Jul. 17, 2003
Applicants:

Makoto Yoshino, Beppu, JP;

Kenji Masumoto, Hiji-machi, JP;

Inventors:

Makoto Yoshino, Beppu, JP;

Kenji Masumoto, Hiji-machi, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L023/495 ;
U.S. Cl.
CPC ...
Abstract

An insulation film for providing an insulation substrate carrying a semiconductor chip of a semiconductor package. Insulation filmis provided with rows of opposing sprocket holesformed on either edge of the above mentioned insulation film, and through holesare disposed two-dimensionally between the rows of sprocket holes. Pitch p between through holesis determined by the relationship mp=nL (i.e., n and m are integers, and n<m), wherein pitch of the sprocket holes is taken to be L. Through holesare selectively utilized during formation of the desired circuit pattern upon insulation filmaccording to size of the manufactured semiconductor package.


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