Ibi-gun, Japan

Kenichi Shimada

This inventor holds 20 USPTO granted patents and 1 published patent application and 12 EPO patents, primarily in Printed Wiring Boards. Top assignee: Ibiden Company Limited. Active years: 2002-2015.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kenichi Shimada. Retrieved from https://idiyas.com/inventor/kenichi-shimada-fg3b8v6r

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 20 

% Patents Active = 20.0

 

Average Co-Inventor Count = 5.0

ph-index = 10

Forward Citations = 291(Granted Patents)


Location History:

  • Nagoya, JP (2009)
  • Gifu, JP (2006 - 2011)
  • Ibi-gun, JP (2002 - 2015)

Company Filing History:


Years Active: 2002-2015

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Areas of Expertise:
Multilayer Printed Wiring Board
Filled Viahole Structure
Printed Circuit Board
Manufacturing Method
Solder Resist Composition
Roughened Surface
Resin Composition
Through-Hole Filling
Semiconductor Device
Production Method
20 patents (USPTO):Explore Patents

Title: Innovator Spotlight: Kenichi Shimada and His Contributions to Printed Wiring Board Technology

Introduction: Kenichi Shimada, based in Ibi-gun, Japan, is a notable inventor in the field of electrical engineering, specifically known for his contributions to printed wiring board technology. With an impressive portfolio of 20 patents, Shimada's work has significantly advanced the capabilities and efficiency of multilayer printed wiring boards.

Latest Patents: Among his recent innovations is the patent for a multilayer printed wiring board with a filled viahole structure. This invention features a multilayered structure comprising conductor circuit layers and interlaminar insulative layers. The filled viahole within this structure includes one or more metal plating fillings, forming a substantially flat surface that enhances the performance of solder bumps. Another significant contribution is the method for producing a multilayer printed circuit board, which outlines a process that starts with a substrate and employs a cycloolefin resin to create an insulating layer. This method integrates various layers and plating techniques to establish reliable connections between conductors within the circuit board.

Career Highlights: Kenichi Shimada's career is marked by his ongoing role at Ibiden Company Limited, where he has been instrumental in developing advanced electrical components. His expertise in multilayer design and manufacturing processes has helped the company maintain its position as a leader in the technology sector.

Collaborations: Throughout his career, Shimada has collaborated with prominent colleagues including Motoo Asai and Dongdong Wang. These partnerships have fostered innovation and the exchange of ideas, contributing to the development of cutting-edge technologies in the field.

Conclusion: Kenichi Shimada's contributions to printed wiring board technology illustrate the important role of inventors in driving industry advancements. With his numerous patents and ongoing collaborations, he continues to influence the future of electrical engineering and the manufacturing processes that support it. His work not only benefits the technology sector but also demonstrates the importance of innovation in creating efficient and reliable electrical components.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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