The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 09, 2011
Filed:
Mar. 24, 2009
Honchin En, Ibi-gun, JP;
Masayuki Hayashi, Ibi-gun, JP;
Dongdong Wang, Ibi-gun, JP;
Kenichi Shimada, Ibi-gun, JP;
Motoo Asai, Ibi-gun, JP;
Koji Sekine, Ibi-gun, JP;
Tohru Nakai, Ibi-gun, JP;
Shinichiro Ichikawa, Ibi-gun, JP;
Yukihiko Toyoda, Ibi-gun, JP;
Honchin En, Ibi-gun, JP;
Masayuki Hayashi, Ibi-gun, JP;
Dongdong Wang, Ibi-gun, JP;
Kenichi Shimada, Ibi-gun, JP;
Motoo Asai, Ibi-gun, JP;
Koji Sekine, Ibi-gun, JP;
Tohru Nakai, Ibi-gun, JP;
Shinichiro Ichikawa, Ibi-gun, JP;
Yukihiko Toyoda, Ibi-gun, JP;
Ibiden Co., Ltd., Ogaki-shi, JP;
Abstract
A multilayer printed circuit board including a substrate board and a built-up structure formed over the substrate board. The built-up structure includes conductor circuits and resin insulating layers. The built-up structure has via holes interconnecting the conductor circuits through one or more resin insulating layers. The via holes are filled up with plating, and the resin insulating layers is formed of a cycloolefin resin.