Ibi-gun, Japan

Honchin En

This inventor holds 18 USPTO granted patents and 11 EPO patents, primarily in Printed Circuit Boards. Top assignee: Ibiden Company Limited. Active years: 2001-2013.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Honchin En. Retrieved from https://idiyas.com/inventor/honchin-en

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 22.2

 

Average Co-Inventor Count = 2.9

ph-index = 9

Forward Citations = 240(Granted Patents)


Location History:

  • Gifu, JP (2001 - 2011)
  • Ibi-gun, JP (2010 - 2013)

Company Filing History:


Years Active: 2001-2013

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Areas of Expertise:
Printed Wiring Board
Manufacturing Method
Electroplating Solution
Multilayer PCB
Conductive Substrate
Roughened Surface
Electroplating Process
PCB Fabrication
18 patents (USPTO):Explore Patents

Title: Honchin En: A Pioneer in Printed Circuit Board Innovations

Introduction

Honchin En, a distinguished inventor based in Ibi-gun, Japan, has made significant contributions to the field of electronics through his innovative work on printed circuit boards. With a remarkable portfolio of 18 patents, his inventions have advanced the manufacturing processes of multilayer printed circuit boards, enhancing their efficiency and functionality.

Latest Patents

Among his latest patents is a method for producing a printed wiring board. This invention describes the process of manufacturing a multilayer printed circuit board, which includes preparing a substrate with a first conductor circuit. It outlines the steps to form an insulating layer using cycloolefin resin, creating an opening to expose parts of the first circuit. The subsequent process involves forming an electroless plating film and a plating resist layer that highlights certain areas of the electroless film, ultimately leading to the creation of a filled via conductor which connects the first circuit to a second circuit.

Another significant patent by Honchin En focuses on the multilayer printed circuit board itself. This invention incorporates a substrate board with a lower conductor circuit, a resin insulating layer above it, and additional conduction circuits formed on this resin. The resin insulating layer is characterized by a via hole that is filled with plating, which is crafted from a linear polyolefin resin through a specialized hot-pressing technique.

Career Highlights

Honchin En's career at Ibiden Company Limited is marked by his dedication to research and development in printed wiring technology. His expertise has not only led to numerous patents but also established him as a leading figure in the field.

Collaborations

Throughout his career, Honchin En has collaborated with other talented professionals, including Tohru Nakai and Masayuki Hayashi. Their combined efforts have fostered a creative environment that has driven advancements in circuit board design and manufacturing techniques.

Conclusion

Honchin En's innovations have made a lasting impact on the electronics industry, particularly through his contributions to printed circuit board technology. With a solid foundation of patents and collaborations, he continues to influence the future of electronic manufacturing, solidifying his reputation as an inventive leader in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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