The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 09, 2010
Filed:
Jan. 06, 2004
Honchin En, Gifu, JP;
Tohru Nakai, Gifu, JP;
Takeo Oki, Tsushima, JP;
Naohiro Hirose, Gifu, JP;
Kouta Noda, Gifu, JP;
Honchin En, Gifu, JP;
Tohru Nakai, Gifu, JP;
Takeo Oki, Tsushima, JP;
Naohiro Hirose, Gifu, JP;
Kouta Noda, Gifu, JP;
Ibiden Co., Ltd., Ogaki-Shi, JP;
Abstract
An electroplating process of electroplating an electrically conductive substrate is described. The process includes electroplating intermittently to a predetermined plating thickness using the substrate surface as a cathode and a plating metal as an anode at a constant voltage between the anode and the cathode by repeating application of a voltage between a cathode and an anode and interruption of the application alternately. It is described that a voltage time/interruption time ratio is 0.1 to 1.0, a voltage time is not longer than 10 seconds, and an interruption time is not less than 1 x 10seconds.