Ibi-gun, Japan

Kouta Noda

This inventor holds 17 USPTO granted patents and 1 published patent application and 6 EPO patents, primarily in Printed Circuit Boards. Top assignee: Ibiden Company Limited. Active years: 1998-2012.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kouta Noda. Retrieved from https://idiyas.com/inventor/kouta-noda

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 17 

% Patents Active = 70.6

 

Average Co-Inventor Count = 4.5

ph-index = 13

Forward Citations = 489(Granted Patents)


Location History:

  • Gifu-Ken, JP (1998)
  • Ogaki, JP (2009)
  • Ibi-gun, JP (2001 - 2011)
  • Gifu, JP (2003 - 2011)
  • Igi-gun, JP (2012)

Company Filing History:


Years Active: 1998-2012

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Areas of Expertise:
Printed Circuit Board
Multilayered Manufacturing
Electroplating Process
Insulating Layer
Resin Composition
Through-Hole Filling
High Density
Multi-Chip Carrier
Adhesive for Plating
Laser Opening
Production Process
17 patents (USPTO):Explore Patents

Title: Innovator Spotlight: Kouta Noda

Introduction

Kouta Noda, a prominent inventor hailing from Ibi-gun, Japan, has made significant contributions to the field of printed circuit board technology. With an impressive portfolio of 17 patents, Noda has established himself as a key figure in advancements that enhance the reliability and efficiency of electronic components.

Latest Patents

Among his most recent innovations are his patents concerning multilayered printed circuit boards and their manufacturing methods. One of his latest patents describes a method wherein an opening is formed in resin using a laser beam to create a via hole. This technique utilizes a copper foil whose thickness has been reduced to 3 μm through etching to minimize thermal conductivity. As a result, a reliable connection of via holes is achieved without the typical issue of resin undercut. Noda's experience is also encapsulated in his patent for a printed wiring board manufacturing method, which promotes simultaneous filling of via holes and formation of conductor circuits while ensuring high crystallinity and uniform deposition on the substrate.

Career Highlights

Noda is currently associated with Ibiden Company Limited, a well-known enterprise in the field of electronics and printed circuit boards. His inventive efforts have not only strengthened the company's position in the market but have also contributed to advancements in electronic manufacturing processes.

Collaborations

Noda's work is complemented by his collaboration with colleagues Naohiro Hirose and Motoo Asai. Together, they form a team that drives innovation in their respective fields, sharing expertise and insights that lead to groundbreaking inventions.

Conclusion

Kouta Noda's inventive spirit and technical expertise continue to pave the way for innovations in the electronics industry. His patents not only reflect a commitment to advancing technology but also highlight the importance of collaboration and teamwork in achieving remarkable advancements. Through his work, Noda exemplifies the ever-evolving landscape of innovation, solidifying his legacy as a leading inventor in the realm of printed circuit boards.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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