The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 13, 2004
Filed:
Nov. 09, 2001
Ibiden Co., Ltd., Gifu, JP;
Abstract
This invention is to propose a technique of producing a printed wiring board having an excellent adhesion property between an electroless plated film and an electrolytic plated film constituting a conductor circuit through a semi-additive process without causing the peeling of a plating resist and is a printed wiring board comprising conductor circuits formed on a roughened surface of an insulating layer, in which the conductor circuit is constituted with an electroless plated film at the side of the insulating layer and an electrolytic plated film at the opposite side and the electroless plated film located at the side of the insulating layer is formed so as to follow to the roughened surface of the insulating layer. This printed wiring board is produced by a semi-additive method wherein the electroless plated film is formed on the roughened surface of the insulating layer so as to follow to the roughened surface of the insulating layer.