The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 06, 2010
Filed:
Apr. 17, 2007
Applicants:
Honchin En, Gifu, JP;
Tohru Nakai, Gifu, JP;
Takeo Oki, Tsushima, JP;
Naohiro Hirose, Gifu, JP;
Kouta Noda, Gifu, JP;
Inventors:
Honchin En, Gifu, JP;
Tohru Nakai, Gifu, JP;
Takeo Oki, Tsushima, JP;
Naohiro Hirose, Gifu, JP;
Kouta Noda, Gifu, JP;
Assignee:
Ibiden Co., Ltd., Gifu, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 18/40 (2006.01); B05D 1/18 (2006.01);
U.S. Cl.
CPC ...
Abstract
The present invention is directed to a process for manufacturing multilayer printed circuit boards which is capable of simultaneous via hole filling and formation of conductor circuit and via holes of good crystallinity, and by which uniform deposition can be constructed on a substrate and high-density wiring and highly reliable conductor connections can be realized without annealing.