The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 15, 2003
Filed:
Mar. 05, 2001
Naohiro Hirose, Ibi-gun, JP;
Kouta Noda, Ibi-gun, JP;
Hiroshi Segawa, Ibi-gun, JP;
Honjin En, Ibi-gun, JP;
Kiyotaka Tsukada, Ogakishi, JP;
Naoto Ishida, Ogakishi, JP;
Kouji Asano, Ogakishi, JP;
Atsushi Shouda, Ogakishi, JP;
IBIDEN Co., Ltd., Gifu, JP;
Abstract
An opening is formed in resin by a laser beam so that a via hole is formed. Copper foil, the thickness of which is reduced to 3 &mgr;m by etching to lower the thermal conductivity, is used as a conformal mask. Therefore, an opening is formed in the resin and the number of irradiation of pulse-shape laser beam is reduced. Thus, occurence of undercut of the resin, which forms an interlayer insulating resin layer, can be prevented and the reliability of the connection of the via holes can be improved.