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For the Inventor, By the Inventor

Ogaki, Japan

Hiroshi Segawa

This inventor holds 13 USPTO granted patents and 1 EPO patent. Top assignee: Ibiden Company Limited. Active years: 2002-2015.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hiroshi Segawa. Retrieved from https://idiyas.com/inventor/hiroshi-segawa-hrvpeicz

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 13

% Patents Active = 84.6


Average Co-Inventor Count = 5.1

ph-index = 6

Forward Citations = 243(Granted Patents)


Location History:

  • Yokohama, JP (2009)
  • Ibi-gun, JP (2002 - 2012)
  • Kawasaki, JP (2012)
  • Ogaki, JP (2011 - 2015)

Company Filing History:

goldMedal13 out of 1,483 
 
Ibiden Company Limited
 patents

Years Active: 2002-2015

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13 patents (USPTO):Explore Patents
1. 9066439 - Wiring board and method for manufacturing the same (2015-06-23),
2. 8997344 - Method for manufacturing interposer (2015-04-07),
3. 8188378 - Interposer and method for manufacturing interposer (2012-05-29),
4. 8178790 - Interposer and method for manufacturing interposer (2012-05-15),
5. 8173907 - Interposer and method for manufacturing interposer (2012-05-08),
6. 8148643 - Multilayered printed circuit board and manufacturing method thereof (2012-04-03),
7. 8058563 - Interposer and method for manufacturing interposer (2011-11-15),
8. 7832098 - Method of manufacturing a multilayered printed circuit board (2010-11-16),
9. RE40947 - Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole (2009-10-26),
10. 7415761 - Method of manufacturing multilayered circuit board (2008-08-26),
11. 6591495 - Manufacturing method of a multilayered printed circuit board having an opening made by a laser, and using electroless and electrolytic plating (2003-07-15),
12. 6376052 - Multilayer printed wiring board and its production process, resin composition for filling through-hole (2002-04-23),
13. 6376049 - Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole (2002-04-23),

Title: Hiroshi Segawa: Innovator in Wiring Board Technology

Introduction

Hiroshi Segawa is a prominent inventor based in Ogaki, Japan. He has made significant contributions to the field of wiring board technology, holding a total of 13 patents. His innovative designs and methods have advanced the manufacturing processes in this area.

Latest Patents

Among his latest patents is a groundbreaking invention related to wiring boards. This patent describes a wiring board that features a first wiring board with a first solder-resist layer. It includes a second wiring board connected to the first and positioned in a first opening portion of the solder-resist layer. Additionally, a third wiring board is connected to the first wiring board and positioned in a second opening portion. This design allows for either a common opening accommodating both the second and third wiring boards or separate openings for each. Another notable patent is a method for manufacturing an interposer. This method involves forming a first insulating layer made of inorganic material on a supporting substrate, followed by the creation of a first wire within this layer. A second insulating layer is then formed, and a second wire, which is longer and thicker than the first, is created on this layer before removing the supporting substrate.

Career Highlights

Hiroshi Segawa is currently employed at Ibiden Company Limited, where he continues to innovate and develop new technologies. His work has been instrumental in enhancing the efficiency and functionality of wiring boards.

Collaborations

Hiroshi has collaborated with talented coworkers, including Kouta Noda and Hajime Sakamoto, contributing to various projects and innovations within the company.

Conclusion

Hiroshi Segawa's contributions to wiring board technology exemplify his dedication to innovation and excellence. His patents and collaborative efforts continue to shape the future of this industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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