The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 29, 2012
Filed:
Dec. 29, 2008
Hajime Sakamoto, Ogaki, JP;
Shuichi Kawano, Ogaki, JP;
Daiki Komatsu, Ogaki, JP;
Toshiki Furutani, Ogaki, JP;
Hiroshi Segawa, Ogaki, JP;
Hajime Sakamoto, Ogaki, JP;
Shuichi Kawano, Ogaki, JP;
Daiki Komatsu, Ogaki, JP;
Toshiki Furutani, Ogaki, JP;
Hiroshi Segawa, Ogaki, JP;
Ibiden Co., Ltd., Ogaki-shi, JP;
Abstract
An interposer having a support substrate, a first insulation layer made of an inorganic material and formed over the support substrate, and a second insulation layer formed over the first insulation layer. The first insulation layer has a first land, a second land and a first wiring electrically connecting the first land and the second land. The second insulation layer has a first pad positioned to load a first electronic component, a second pad positioned to load a second electronic component, a second wiring electrically connected to the second pad, a first via conductor electrically connecting the first land and the first pad, and a second via conductor electrically connecting the second land and the second wiring. The first wiring and second wiring electrically connect the first pad and the second pad, and the second wiring has a lower wiring resistance per unit length than the first wiring.