Honjin En

Title: **Honjin En: A Pioneer in Multilayered Printed Circuit Board Innovations**

Introduction

Honjin En, an innovative inventor based in Ibi-gun, Japan, has made significant contributions to the field of printed circuit board technology. With a total of seven patents to his name, En has been at the forefront of advancements in multilayered build-up wiring boards, enhancing both their manufacturing processes and reliability.

Latest Patents

Among Honjin En's latest patents is a groundbreaking invention related to multilayered printed circuit boards and their manufacturing methods. This patent describes a technique where an opening is created in resin using a laser beam to form via holes. Essential to this process is the use of copper foil, which has been etched to reduce its thickness to 3 μm, thereby lowering thermal conductivity. By minimizing the number of laser beam pulses required, the potential for undercutting the resin layer is significantly reduced, enhancing the overall reliability of the connections of the via holes.

Additionally, En has developed a multilayer build-up wiring board that includes a chip mount region. This invention features mesh holes formed in the upper solid layers, designed to maintain the integrity of the interlayer resin insulating layers. The mesh hole diameter is carefully specified between 75 to 300 μm, ensuring optimal overlying of holes, while keeping a specific distance of 100 to 2000 μm to prevent deterioration of insulating properties.

Career Highlights

Throughout his career, Honjin En has targeted innovation with precision and foresight. His work at Ibiden Company Limited has been instrumental in advancing multilayered printed circuit technology, leading to more efficient manufacturing methods and enhanced end-product quality. His seven patents underscore a dedication to improving the reliability and efficiency of electronic components integral to modern technology.

Collaborations

Honjin En has collaborated with notable colleagues, including Naohiro Hirose and Kouta Noda, contributing to a collective effort to push the boundaries of printed circuit board innovation. Their joint endeavors highlight the importance of teamwork in achieving groundbreaking technological advancements.

Conclusion

Honjin En is a formidable figure in the realm of multilayered printed circuit boards, whose inventions have set new standards in manufacturing processes and reliability. His contributions reflect a deep understanding of both the material and technical challenges in electronics. En's innovative spirit and collaborative mindset ensure that he remains a vital player in driving forward circuit board technology.