Ibiden Company Limited

Kouta Noda

Naohiro Hirose

Motoo Asai

Hiroshi Segawa

Takashi Kariya

Kiyotaka Tsukada

Honchin En

Naoto Ishida

Tohru Nakai

Kouji Asano

Takeo Oki

Honjin En

Atsushi Shouda

Kenichi Shimada

Masato Kawade

Yoshitaka Ono

Youko Nishiwaki

Yasushi Inagaki

Ken-ichi Shimada

Benzhen Yuan

Yoko Nishiwaki

Tooru Inoue

Hiroshi Ibiden Co Ltd Segawa

Takashi Ibiden Co Ltd Kariya

An opening is formed in resinby a laser beam so that a via hole is formed. At this time, copper foil, the thickness of which is reduced (to 3 &#x3bc;m) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an openingcan be formed in the resinif the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resinwhich forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be improved.

Multilayered printed circuit board and manufacturing method thereof

The present invention has for its object to provide a process for manufacturing multilayer printed circuit boards which is capable of simultaneous via hole filling and formation of conductor circuit and via holes of good crystallinity and uniform deposition can be constructed on a substrate and high-density wiring and highly reliable conductor connections can be realized without annealing. The present invention is related to a process for manufacturing multilayer printed circuit boards which comprises disposing an interlayer resin insulating layer on a substrate formed with a conductor circuit, creating openings for formation of via holes in said interlayer resin insulating layer, forming an electroless plated metal layer on said interlayer resin insulating layer, disposing a resist thereon, performing electroplating, stripping the resist off and etching the electroless plated metal layer to provide a conductor circuit and via holes, wherein the electroplating is performed intermittently using said electroless plated metal layer as cathode and a plating metal as anode at a constant voltage between said anode and said cathode.

Printed wiring board and its manufacturing method

A printed wiring board is provided which includes an interlayer dielectric layer formed on a substrate from a curable resin having flaky particles dispersed therein. The printed wiring board is excellent in cooling/heating cycle resistance and packaging reliability while maintaining a satisfactory heat resistance, electrical insulation, heat liberation, connection reliability and chemical stability. Also a method of producing a printed wiring board is proposed in which an imprint method using a mold having formed thereon convexities corresponding to wiring patterns and viaholes to be formed being buried in an interlayer dielectric layer is used to form the wiring patterns and viaholes by transcribing the concavities of the mold to the interlayer dielectric layer. The imprint method permits to form the wiring patterns and viaholes but assures an easy and accurate transcription without any optical transcription or complicated etching. Thus, a multilayer printed wiring board excellent in insulation reliability and interlayer connection and having fine wiring patterns formed therein can be mass-produced extremely easily and inexpensively.

Interlayer insulating layer for printed wiring board, printed wiring board and method for manufacturing same

Method of manufacturing a multilayered printed circuit board

An electroplating process of electroplating an electrically conductive substrate is described. The process includes electroplating intermittently to a predetermined plating thickness using the substrate surface as a cathode and a plating metal as an anode at a constant voltage between the anode and the cathode by repeating application of a voltage between a cathode and an anode and interruption of the application alternately. It is described that a voltage time/interruption time ratio is 0.1 to 1.0, a voltage time is not longer than 10 seconds, and an interruption time is not less than 1 x 10seconds.

Electroplating process of electroplating an elecrically conductive sustrate

The present invention is directed to a process for manufacturing multilayer printed circuit boards which is capable of simultaneous via hole filling and formation of conductor circuit and via holes of good crystallinity, and by which uniform deposition can be constructed on a substrate and high-density wiring and highly reliable conductor connections can be realized without annealing.

A multilayer printed wiring board is composed of a substrate provided with through-holes, and a wiring board formed on the substrate through the interposition of an interlaminar insulating resin layer, the through-holes having a roughened internal surface and being filled with a filler, an exposed part of the filler in the through-holes being covered with a through-hole-covering conductor layer, and a viahole formed just thereabove being connected to the through-hole-covering conductor layer. Without peeling between the through-holes and the filler, this wiring board has a satisfactory connection reliability between the through-holes and the internal layer circuit and provides a high density wiring.

Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole

Method of manufacturing multilayered circuit board

This invention is to propose a technique of producing a printed wiring board having an excellent adhesion property between an electroless plated film and an electrolytic plated film constituting a conductor circuit through a semi-additive process without causing the peeling of a plating resist and is a printed wiring board comprising conductor circuits formed on a roughened surface of an insulating layer, in which the conductor circuit is constituted with an electroless plated film at the side of the insulating layer and an electrolytic plated film at the opposite side and the electroless plated film located at the side of the insulating layer is formed so as to follow to the roughened surface of the insulating layer. This printed wiring board is produced by a semi-additive method wherein the electroless plated film is formed on the roughened surface of the insulating layer so as to follow to the roughened surface of the insulating layer.

Multilayer printed-circuit board and method of manufacture

An opening is formed in resin by a laser beam so that a via hole is formed. Copper foil, the thickness of which is reduced to 3 &mgr;m by etching to lower the thermal conductivity, is used as a conformal mask. Therefore, an opening is formed in the resin and the number of irradiation of pulse-shape laser beam is reduced. Thus, occurence of undercut of the resin, which forms an interlayer insulating resin layer, can be prevented and the reliability of the connection of the via holes can be improved.

Manufacturing method of a multilayered printed circuit board having an opening made by a laser, and using electroless and electrolytic plating

A multilayer printed wiring board has such a structure that conductor circuit patterns are formed on a core substrate through interlaminar resin insulating layers and through-holes are formed in the core substrate and a filler is filled in the through-hole. The interlaminar resin insulating layer formed on the substrate is flat and the same kind of roughened layer is formed on the conductor circuit pattern on the substrate over a full surface including a side surface thereof. A cover plated layer is formed just above the through-hole, and the roughened layers are formed on the conductor layer and the conductor circuit pattern located at the same level as the conductor layer over a full surface including side surfaces thereof, and the interlaminar resin insulating layer is formed so as to cover the surfaces of these roughened layers and filled in recess portions between the conductors and flattened on its surface. Thus, it is excellent in the crack resistance under heat cycle condition or the like and does not cause the damage of the cover plated layer.

Multilayer printed wiring board having a roughened inner conductor layer and production method thereof

Multilayer printed wiring board and its production process, resin composition for filling through-hole

The adhesive for electroless plating which is advantageous to ensure insulation reliabilities between lines and between layers while maintaining a practical peel strength, and the printed circuit board using the adhesive are disclosed. The adhesive is formed by dispersing cured heat-resistant resin particles soluble in acid or oxidizing agent into uncured heat-resistant resin matrix hardly soluble in acid or oxidizing agent through curing treatment, in which the heat-resistant resin particles have an average particle size of not more than 1.5 &mgr;m.

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Ibi-gun, Japan

Kouta Noda