The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 17, 2013
Filed:
Mar. 24, 2009
Honchin En, Ibi-gun, JP;
Masayuki Hayashi, Ibi-gun, JP;
Dongdong Wang, Ibi-gun, JP;
Kenichi Shimada, Ibi-gun, JP;
Motoo Asai, Ibi-gun, JP;
Koji Sekine, Ibi-gun, JP;
Tohru Nakai, Ibi-gun, JP;
Shinichiro Ichikawa, Ibi-gun, JP;
Yukihiko Toyoda, Ibi-gun, JP;
Honchin En, Ibi-gun, JP;
Masayuki Hayashi, Ibi-gun, JP;
Dongdong Wang, Ibi-gun, JP;
Kenichi Shimada, Ibi-gun, JP;
Motoo Asai, Ibi-gun, JP;
Koji Sekine, Ibi-gun, JP;
Tohru Nakai, Ibi-gun, JP;
Shinichiro Ichikawa, Ibi-gun, JP;
Yukihiko Toyoda, Ibi-gun, JP;
Ibiden Co., Ltd., Ogaki-shi, JP;
Abstract
A method of manufacturing a multilayer printed circuit board includes preparing a substrate having a first conductor circuit, forming on first circuit formed over substrate a film including cycloolefin resin such that an insulating layer including the resin is formed on substrate and first circuit, forming in insulating layer an opening exposing at least portion of first circuit, forming an electroless plating film covering surface of insulating layer including surface of insulating layer inside opening, forming on electroless film a plating resist layer having pattern exposing selected portions of electroless film, selected portions of electroless film including a second conductor circuit and a portion of electroless film covering opening, and forming an electrolytic plating film covering selected portions of electroless film such that a filled via conductor including an electrolytic material filling space in opening and that first circuit is connected to second circuit via conductor.