The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 2011
Filed:
Jun. 25, 2008
Honchin En, Ibi-gun, JP;
Masayuki Hayashi, Ibi-gun, JP;
Dongdong Wang, Ibi-gun, JP;
Kenichi Shimada, Ibi-gun, JP;
Motoo Asai, Ibi-gun, JP;
Koji Sekine, Ibi-gun, JP;
Tohru Nakai, Ibi-gun, JP;
Shinichiro Ichikawa, Ibi-gun, JP;
Yukihiko Toyoda, Ibi-gun, JP;
Honchin En, Ibi-gun, JP;
Masayuki Hayashi, Ibi-gun, JP;
Dongdong Wang, Ibi-gun, JP;
Kenichi Shimada, Ibi-gun, JP;
Motoo Asai, Ibi-gun, JP;
Koji Sekine, Ibi-gun, JP;
Tohru Nakai, Ibi-gun, JP;
Shinichiro Ichikawa, Ibi-gun, JP;
Yukihiko Toyoda, Ibi-gun, JP;
Ibiden Co., Ltd., Ogaki-shi, JP;
Abstract
The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin.