The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 29, 2011
Filed:
Jul. 28, 2000
Hui Zhong, Gifu, JP;
Kenichi Shimada, Gifu, JP;
Yukihiko Toyoda, Gifu, JP;
Motoo Asai, Gifu, JP;
Dongdong Wang, Gifu, JP;
Koji Sekine, Gifu, JP;
Yoshitaka Ono, Gifu, JP;
Hui Zhong, Gifu, JP;
Kenichi Shimada, Gifu, JP;
Yukihiko Toyoda, Gifu, JP;
Motoo Asai, Gifu, JP;
Dongdong Wang, Gifu, JP;
Koji Sekine, Gifu, JP;
Yoshitaka Ono, Gifu, JP;
Ibiden Co., Ltd., Ogaki-shi, JP;
Abstract
The present invention is to provide a multilayered printed circuit board free from cracks attributed to thermal expansion difference between a solder resist layer and another part and a multilayered printed circuit board of the present invention comprises a conductor circuit and a resin insulating layer serially formed on a substrate in an alternate fashion and in repetition and a solder resist layer formed as an outermost layer, and the solder resist layer contains an inorganic filler.