The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 15, 2010
Filed:
Jun. 30, 2008
Seiji Shirai, Ibi-gun, JP;
Kenichi Shimada, Ibi-gun, JP;
Motoo Asai, Ibi-gun, JP;
Ibiden Co., Ltd., Ogaki-shi, JP;
Abstract
A multilayer printed wiring board having a multilayered structure including multiple conductor circuit layers and multiple interlaminar insulative layers, the conductor layers having one or more conductor circuit portions, the interlaminar insulative resin layers including the outermost interlaminar insulative resin layer forming the outermost layer of the multilayered structure, a filled-viahole formed in the outermost interlaminar insulative resin layer and made of one or more metal plating filling and completely closing a hole formed through the outermost interlaminar insulative resin layer, the metal plating of the filled-viahole extending out of the hole and having a substantially flat surface, the filled-viahole electrically connected to the conductor circuit portion in the conductor circuit layers, and a solder bump formed on the substantially flat surface of the filled-viahole.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile