This inventor holds 17 USPTO granted patents and 2 published patent applications, primarily in Semiconductor Packaging. Top assignees: Industrial Technology Research Institute, Mediatek Corporation. Active years: 1999-2015.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Location History:
- Hsinchu Hsien, TW (2009)
- Hsinchu, TW (1999 - 2015)
- Hsinchu County, TW (2015)
Company Filing History:
16 out of 9,312 
1 out of 5,127 
Years Active: 1999-2015
Areas of Expertise:
Title: Keng-Li Su: Innovator in Semiconductor Technology
Introduction
Keng-Li Su is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 17 patents. His innovative work focuses on enhancing the functionality and reliability of semiconductor devices.
Latest Patents
One of Keng-Li Su's latest patents is a through silicon via (TSV) repair circuit of a semiconductor apparatus. This invention includes a first chip, at least one second chip, at least two TSVs, at least two data path circuits, and an output logic circuit. Each data path circuit is designed with an input driving circuit, a short-circuit detection circuit, a bias circuit, and a leakage current cancellation circuit. The input driving circuit transforms an input signal into a pending signal, which is then transmitted to the first terminal of the corresponding TSV. The short-circuit detection circuit identifies any short circuit between the TSV and the silicon substrate, generating a short-circuit detection output signal. Additionally, the leakage current cancellation circuit prevents leakage current from entering the silicon substrate based on the short-circuit detection output signal.
Another notable patent by Keng-Li Su is also a through silicon via (TSV) repair circuit. This circuit comprises at least two transmission control switches and at least two transmission path modules. The transmission control switches transmit an input signal from either the first chip or the second chip to one of the terminals in each transmission path module according to a switch signal. Each transmission path module includes at least two data path circuits and corresponding TSVs. The data path circuits are equipped with an input driving circuit, a short-circuit detection circuit, and a leakage current cancellation circuit, which work together to detect short circuits and prevent leakage current from affecting the silicon substrate.
Career Highlights
Keng-Li Su has worked with notable organizations such as the Industrial Technology Research Institute and MediaTek Corporation. His experience in these companies has allowed him to develop and refine his innovative ideas in semiconductor technology.
Collaborations
Keng-Li Su has collaborated with talented individuals in his field, including Chih-Sheng Lin and Chih-Wen Hsiao. These collaborations have contributed to the advancement of semiconductor technologies and innovations.
Conclusion
Keng-Li Su is a distinguished inventor whose work in
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile