The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 12, 2013
Filed:
Dec. 15, 2010
Keng-li Su, Hsinchu, TW;
Hsin-chi Lai, Taichung, TW;
Chih-sheng Lin, Tainan County, TW;
Zhe-hui Lin, Changhua County, TW;
Keng-Li Su, Hsinchu, TW;
Hsin-Chi Lai, Taichung, TW;
Chih-Sheng Lin, Tainan County, TW;
Zhe-Hui Lin, Changhua County, TW;
Industrial Technology Research Institute, Hsinchu, TW;
Abstract
A multi-chip stack structure including a first chip, a second chip, a shielding layer, and a plurality of conductive bumps is provided. The second chip is stacked on the first chip. The second chip has a plurality of through silicon via (TSV) structures to conduct a reference voltage. The shielding layer and the plurality of conductive bumps are disposed between the first chip and the second chip, and are electrically connected to the plurality of TSV structures. The shielding layer can isolate noises and improve signal coupling between two adjacent chips.