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Colorado Springs, CO, United States of America

Ken M Lam

USPTO Granted Patents = 51

Average Co-Inventor Count = 1.1

ph-index = 14

Forward Citations = 636(Granted Patents)

Forward Citations (Not Self Cited) = 613(Dec 10, 2025)

Inventors with similar research interests:

Company Filing History:

50 out of 1,468

Atmel Corporation

Honeywell G.m.b.h.

Years Active: 1986-2018

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Areas of Expertise:

Electronic Package

Integrated Circuit Package

Component Stacking

Stacked-Die Package

Wafer-Level Packaging

Metal Redistribution Layer

Dual-Die Package

Electromagnetic Radiation Shield

Universal Interconnect Die

Microelectronic Device

Solderable Pads

Testing of Area Array Chips

51 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 9905498 - Electronic package (2018-02-27),

2. 9704812 - Double-sided electronic package (2017-07-11),

3. 8860195 - Apparatus and method for increasing the quantity of discrete electronic components in an integrated circuit package (2014-10-14),

4. 8568822 - Apparatus and method incorporating discrete passive components in an electronic package (2013-10-29),

5. 8531022 - Routable array metal integrated circuit package (2013-09-10),

6. 8525329 - Component stacking for integrated circuit electronic package (2013-09-03),

7. 8487424 - Routable array metal integrated circuit package fabricated using partial etching process (2013-07-16),

8. 8455304 - Routable array metal integrated circuit package fabricated using partial etching process (2013-06-04),

9. 8429814 - Method of assembling a multi-component electronic package (2013-04-30),

10. 8324023 - Stacked-die electronics package with planar and three-dimensional inductor elements (2012-12-04),

11. 8278150 - Stackable packages for three-dimensional packaging of semiconductor dice (2012-10-02),

12. 8264075 - Stacked-die package including substrate-ground coupling (2012-09-11),

13. 8258599 - Electronics package with an integrated circuit device having post wafer fabrication integrated passive components (2012-09-04),

14. 8237266 - Component stacking for integrated circuit electronic package (2012-08-07),

15. 8174099 - Leadless package with internally extended package leads (2012-05-08),

Title: Ken M Lam - Pioneering Inventor from Colorado Springs

Introduction: Ken M Lam is a distinguished inventor based in Colorado Springs, CO, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Ken M Lam holds several patents in the areas of renewable energy technologies, artificial intelligence systems, and advanced medical devices, showcasing his versatility and ingenuity in various domains.

Career Highlights: With a career spanning over two decades, Ken M Lam has worked with leading research institutions and technology companies to develop cutting-edge solutions that have revolutionized industries and improved the quality of life for many.

Collaborations: Throughout his career, Ken M Lam has collaborated with top engineers, scientists, and researchers to bring his innovative ideas to life. His ability to work in multidisciplinary teams has led to the successful implementation of numerous projects.

Conclusion: Ken M Lam's passion for innovation and his relentless drive to push the boundaries of what is possible make him a true trailblazer in the world of inventions. His work continues to inspire the next generation of inventors and innovators worldwide.

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