The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 08, 2012
Filed:
Aug. 13, 2008
Ken Lam, Colorado Springs, CO (US);
Ken Lam, Colorado Springs, CO (US);
Atmel Corporation, San Jose, CA (US);
Abstract
A DFN package includes internally extended package leads. One or more package pads are physically and electrically extended from a first edge of the package to a second, opposite edge of the package. These extended package leads can terminate at the edges of the leadframe. The package pads and the extended package leads where the IC die is attached can have full leadframe thickness. Other extended package lead features can have a reduced leadframe thickness (e.g., about half the leadframe thickness). Leadframe features can be physically and electrically connected to a tie-bar feature which can be an integral part of a leadframe matrix. The tie-bar can stabilize the leadframe features during assembly. The tie-bar can also provide electrical connectivity for post assembly leadframe plating. The tie-bar can be removed during package singulation by sawing or punching techniques to free the leadframe features both physically and electrically.