The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 11, 2017
Filed:
May. 06, 2016
Atmel Corporation, San Jose, CA (US);
Ken M. Lam, Colorado Springs, CO (US);
Atmel Corporation, San Jose, CA (US);
Abstract
Embodiments of a double-sided electronic package and methods for fabricating the same are disclosed. In an embodiment, an electronic package comprises: a substrate having a first surface and a second surface; a leadframe having package pad features attached to the first surface of the substrate; a first integrated circuit die attached to the leadframe and electrically coupled to at least one of the package pad features; and molding disposed on the first surface of the substrate between the package pad features, such that the package pad features extend vertically from the first surface of the substrate to a surface of the electronic package, the package pad features forming electrically conductive paths that are exposed on the surface of the electronic package.