The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 14, 2014
Filed:
Aug. 03, 2009
Ken M. Lam, Colorado Springs, CO (US);
Ken M. Lam, Colorado Springs, CO (US);
Atmel Corporation, San Jose, CA (US);
Abstract
An apparatus and method for incorporating discrete passive components into an integrated circuit package. A first surface of a substrate is coated with a material to mechanically protect the first surface. A first metal layer and then an insulating layer are formed on a second surface of the substrate. Selected areas are removed from the insulating and a second metal layer is formed over the insulating layer and the exposed metal layer. Selected areas of the second metal layer are removed to form a plurality of structures, including at least one of a wirebonding pad, a solder-bonding pad, a device interconnect circuit, or an attach pad to which an electronic component may be attached. An electronic component may be attached to at least one of the structures. The resulting integrated circuit die may be incorporated into an electronic package.