The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 30, 2013
Filed:
Sep. 17, 2010
Ken M. Lam, Colorado Springs, CO (US);
Ken M. Lam, Colorado Springs, CO (US);
Atmel Corporation, San Jose, CA (US);
Abstract
An electronic multi-component package is assembled by placing multiple electronic components within multiple openings of a package substrate, then depositing and curing adhesive filler in gaps between the components and the inner peripheries of the openings. Circuit features, including conductive interconnects, are formed by thin-film photolithography over both front and back surfaces of the package substrate. Preformed conductive vias through the package substrate provide electrical connection between circuit features on opposite substrate surfaces. Additional electronic components may be attached to conductive lands on at least one side of the package. The circuit features also include contact pads for external package connections, such as in a ball-grid-array or equivalent structure.