Kazushi Hatauchi

Title: Kazushi Hatauchi: Semiconductor Packaging and Manufacturing Innovations.

Introduction

Kazushi Hatauchi is an inventor based in Tokyo, Japan, whose work includes semiconductor-device manufacturing and packaging. His listed portfolio includes 6 patents, with inventions addressing chip placement accuracy and electrical isolation within semiconductor packages.

Latest Patents

Method for Manufacturing Semiconductor Device. This invention improves the positional accuracy of semiconductor chips during assembly of a system-in-package (SIP). It uses a surface non-contact collet to place a microcomputer chip, which does not require high positional accuracy, and a surface contact collet to place an ASIC chip, which does. Using the two collet types for their respective tasks helps achieve accurate ASIC placement and stabilize SIP quality.

Semiconductor Device Including Power Supply Bar Having Jutted Portion, Parallel Running Portion and Bent Portion and Manufacturing Method Therefor. This invention is designed to prevent a bonding wire from short-circuiting against other conductive parts. Its structure positions a power supply bar’s jutted portion below the top face of an inner-lead tip and places a bent portion of the bonding wire outside the semiconductor chip’s perimeter. These features help maintain electrical separation within the device.

Career Highlights

Hatauchi’s listed company affiliations include Renesas Electronics Corporation and Renesas Technology Corp. His patent work reflects a focus on semiconductor assembly, device structure, and manufacturing methods.

Collaborations

His listed coworkers include Kazuyuki Misumi and Katsuyuki Fukudome.

Conclusion

Kazushi Hatauchi’s inventions address practical challenges in semiconductor manufacturing, including precise chip placement and reliable electrical isolation, contributing to the design and assembly of semiconductor devices.