The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6858920 B1

PDF
Full Text
Expired
Date of Patent:
Feb. 22, 2005

Filed:

Mar. 03, 2003
Applicant:

Kazushi Hatauchi, Tokyo, JP;

Inventor:

Kazushi Hatauchi, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L023/495 ;
U.S. Cl.
CPC ...
Abstract

In a semiconductor device, a substratecarries the first semiconductor elementand the second semiconductor element. The first semiconductor elementhas a plurality of first padsand a plurality of second padsarrayed along two facing sides of a major surface. The second semiconductor elementhas a plurality of third padsalong sides where the first padsand the second padsare arrayed, and a plurality of fourth padsalong sides where the first padsand the second padsare not arrayed. First wiringselectrically connect the plurality of third padsto the plurality of fourth padson the major surface. A plurality of electrodesis arrayed along all the circumferential sides of the major surface of the substrate. Second wiringselectrically connect the plurality of first padsand the plurality of fourth padsrespectively to the plurality of electrodes. Third wiringselectrically connect the plurality of second padsto the plurality of third pads


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