The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 27, 2002
Filed:
Oct. 06, 2000
Applicant:
Inventors:
Kazushi Hatauchi, Tokyo, JP;
Tadashi Mitarai, Tokyo, JP;
Assignee:
Other;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/3495 ;
U.S. Cl.
CPC ...
H01L 2/3495 ;
Abstract
The front surface (where a bonding electrode is located) of a first semiconductor chip is bonded to a die-pad portion of a lead frame by an adhesive . The rear surface of the second semiconductor chip is bonded to the rear surface of the first semiconductor chip . The surface electrode of the first semiconductor chip is electrically connected to an inner lead portion of the lead frame by a bonding wire. The surface electrode of the second semiconductor chip is connected to the inner lead potion of the lead frame by the bonding wire.