The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 29, 2011

Filed:

Sep. 15, 2008
Applicants:

Kazuyuki Misumi, Tokyo, JP;

Kazushi Hatauchi, Tokyo, JP;

Inventors:

Kazuyuki Misumi, Tokyo, JP;

Kazushi Hatauchi, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/50 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor device comprises: a first and second die pads arranged side by side; a plurality of inner leads arranged around the first and second die pads; first and second chips mounted on the first and second die pads; a bar provided between the first and second chips and the plurality of inner leads, extending in an array direction of the first chip and the second chip; a plurality of wires that connect the first and second chips and the plurality of inner leads and connect the first chip and the second chip; and resin that seals the first and second die pads, the plurality of inner leads, the first and second chips, the plurality of wires and the bar, wherein the bar comprises a mark provided at a position corresponding to an area between the first chip and the second chip in an array direction of the first chip and the second chip.


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