The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 17, 2012
Filed:
May. 11, 2009
Kazuyuki Misumi, Tokyo, JP;
Katsuyuki Fukudome, Tokyo, JP;
Kazushi Hatauchi, Tokyo, JP;
Kazuya Fukuhara, Tokyo, JP;
Kunihiro Yamashita, Tokyo, JP;
Kazuyuki Misumi, Tokyo, JP;
Katsuyuki Fukudome, Tokyo, JP;
Kazushi Hatauchi, Tokyo, JP;
Kazuya Fukuhara, Tokyo, JP;
Kunihiro Yamashita, Tokyo, JP;
Renesas Electronics Corporation, Kanagawa, JP;
Abstract
A semiconductor device and a manufacturing method therefor wherein a wire for coupling an inner lead and a semiconductor chip with each other can be prevented from being electrically short-circuited to any other conductive part are provided. An inner lead portion has a tip arranged outside the outer circumferential end of the semiconductor chip as viewed on a plane. A power supply bar has a jutted portion extended between the outer circumferential end of the semiconductor chip and the tip of the inner lead portion as viewed on a plane. The upper face of the jutted portion is in a position lower than the upper face of the tip of the inner lead portion. A bonding wire for electrically coupling the semiconductor chip and the inner lead portion with each other has a bent portion outside the outer circumferential end of the semiconductor chip as viewed on a plane.