The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 27, 2010
Filed:
Mar. 05, 2008
Kazuyuki Misumi, Tokyo, JP;
Kazushi Hatauchi, Tokyo, JP;
Yasuki Takata, Tokyo, JP;
Naoya Yasuda, Tokyo, JP;
Hideyuki Arakawa, Tokyo, JP;
Katsuyuki Fukudome, Tokyo, JP;
Kazuyuki Misumi, Tokyo, JP;
Kazushi Hatauchi, Tokyo, JP;
Yasuki Takata, Tokyo, JP;
Naoya Yasuda, Tokyo, JP;
Hideyuki Arakawa, Tokyo, JP;
Katsuyuki Fukudome, Tokyo, JP;
Renesas Technology Corp., Tokyo, JP;
Abstract
A plurality of inner leadsare provided around a die pad. A grounded GND leadis provided in a region between the die padand the plurality of inner leads. A semiconductor chipand the plurality of inner leadsare connected to each other by a plurality of wires. The semiconductor chipand the GND leadare connected to each other by GND wires. The GND wiresare disposed between a plurality of wires. The distance between ends of each adjacent pair of the inner leadsis 0.2 mm or less.