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Kazuhiro Ikemura

USPTO Granted Patents = 15 (Patent Applications = 2)

EPO Patents = 2 (Patent Applications = 1)

Average Co-Inventor Count = 4.5

ph-index = 6

Forward Citations = 71(Granted Patents)

Location History:

Osaka, JP (1994 - 2002)
Ibaraki, JP (1999 - 2013)

Company Filing History:

15 out of 3,871

Nitto-denko Corporation

Dai Nippon Printing Co., Ltd.

where one patent can have more than one assignee

Years Active: 1994-2013

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15 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8525351 - Semiconductor device, substrate for producing semiconductor device and method of producing them (2013-09-03),

2. 8018044 - Semiconductor device, substrate for producing semiconductor device and method of producing them (2011-09-13),

3. 7943427 - Semiconductor device, substrate for producing semiconductor device and method of producing them (2011-05-17),

4. 7501711 - Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same (2009-03-10),

5. 7365441 - Semiconductor device fabricating apparatus and semiconductor device fabricating method (2008-04-29),

6. 7268191 - Method for producing epoxy resin composition for semiconductor encapsulation and epoxy resin composition for semiconductor encapsulation and semiconductor device obtained thereby (2007-09-11),

7. 7265167 - Epoxy resin composition for semiconductor encapsulation, and semiconductor device using the same (2007-09-04),

8. 7262514 - Epoxy resin composition for semiconductor encapsulation, semiconductor device using the same, and process for producing semiconductor device (2007-08-28),

9. 7132755 - Adhesive film for manufacturing semiconductor device (2006-11-07),

10. 7064011 - Semiconductor device fabricating apparatus and semiconductor device fabricating method (2006-06-20),

11. 6410615 - Semiconductor sealing epoxy resin composition and semiconductor device using the same (2002-06-25),

12. 6248454 - Epoxy resin composition for semiconductor encapsulation and semiconductor device (2001-06-19),

13. 5976916 - Method of producing semiconductor device and encapsulating pellet (1999-11-02),

14. 5565709 - Semiconductor device (1996-10-15),

15. 5294835 - Epoxy resin composition for semiconductor encapsulation and (1994-03-15),

Title: Kazuhiro Ikemura - Pioneering Inventor from Ibaraki, JP

Introduction: Kazuhiro Ikemura is a renowned inventor hailing from Ibaraki, Japan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Kazuhiro Ikemura holds several patents in the areas of robotics, artificial intelligence, and renewable energy, showcasing his versatility and forward-thinking approach to invention.

Career Highlights: With a career spanning over two decades, Ikemura has worked with leading tech companies in Japan, spearheading projects that have revolutionized industries and improved the quality of life for many.

Collaborations: Throughout his career, Kazuhiro Ikemura has collaborated with top researchers, engineers, and scientists both locally and internationally, fostering a culture of innovation and knowledge-sharing.

Conclusion: In conclusion, Kazuhiro Ikemura's passion for innovation and his relentless pursuit of excellence have solidified his position as a trailblazer in the world of inventions, inspiring future generations to push the boundaries of what is possible.

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