The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 04, 2007
Filed:
Nov. 10, 2003
Shinya Akizuki, Ibaraki, JP;
Kazuhiro Ikemura, Ibaraki, JP;
Hisataka Ito, Ibaraki, JP;
Takahiro Uchida, Ibaraki, JP;
Takuya Eto, Ibaraki, JP;
Tsutomu Nishioka, Ibaraki, JP;
Katsumi Shimada, Ibaraki, JP;
Shinya Akizuki, Ibaraki, JP;
Kazuhiro Ikemura, Ibaraki, JP;
Hisataka Ito, Ibaraki, JP;
Takahiro Uchida, Ibaraki, JP;
Takuya Eto, Ibaraki, JP;
Tsutomu Nishioka, Ibaraki, JP;
Katsumi Shimada, Ibaraki, JP;
Nitto Denko Corporation, Osaka, JP;
Abstract
An epoxy resin composition for semiconductor encapsulation capable of giving semiconductor devices of high reliability that do not cause short circuits even in pitch reduction in the interconnection electrode distance or the conductor wire distance therein as well as a semiconductor device using the same. The epoxy resin composition for semiconductor encapsulation, which comprises the following components (A) to (C): (A) an epoxy resin, (B) a phenolic resin, and (C) an inorganic filler for preventing semiconductors from short-circuiting in a step of semiconductor encapsulation.