The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 07, 2006
Filed:
Dec. 16, 2004
Kazuhito Hosokawa, Ibaraki, JP;
Takuji Okeyui, Ibaraki, JP;
Kazuhiro Ikemura, Ibaraki, JP;
Keisuke Yoshikawa, Ibaraki, JP;
Kazuhito Hosokawa, Ibaraki, JP;
Takuji Okeyui, Ibaraki, JP;
Kazuhiro Ikemura, Ibaraki, JP;
Keisuke Yoshikawa, Ibaraki, JP;
Nitto Denko Corporation, Ibaraki, JP;
Abstract
An adhesive film for manufacturing a semiconductor device comprising a thermosetting adhesive layer and a heat-resistant backing layer, wherein the adhesive film is applied to a method for manufacturing a semiconductor device, comprising the steps of (a) embedding at least a part of a conductor in the adhesive film to form a conductor adhered thereto; (b) mounting a semiconductor chip on the conductor; (c) connecting the semiconductor chip to the conductor; (d) encapsulating the semiconductor chip with an encapsulation resin; and (e) removing the adhesive film therefrom. The adhesive film can be suitably used for manufacturing a semiconductor device having a so-called standoff wherein a part of a conductor is projecting from an encapsulation resin.