The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 17, 2011
Filed:
Jul. 13, 2005
Chikao Ikenaga, Tokyo-To, JP;
Kentarou Seki, Tokyo-To, JP;
Kazuhito Hosokawa, Ibaraki, JP;
Takuji Okeyui, Ibaraki, JP;
Keisuke Yoshikawa, Ibaraki, JP;
Kazuhiro Ikemura, Ibaraki, JP;
Chikao Ikenaga, Tokyo-To, JP;
Kentarou Seki, Tokyo-To, JP;
Kazuhito Hosokawa, Ibaraki, JP;
Takuji Okeyui, Ibaraki, JP;
Keisuke Yoshikawa, Ibaraki, JP;
Kazuhiro Ikemura, Ibaraki, JP;
Dai Nippon Printing Co., Ltd., Tokyo, JP;
Nitto Denko Corporation, Ibaraki-shi, JP;
Abstract
A substrate B for use in production of a semiconductor device is used, which substrate includes an adhesive sheethaving a base layerand an adhesive layer, and a plurality of independently provided electrically conductive portions. A semiconductor element having electrodesformed thereon is firmly fixed onto the substrate B, and upper portions of the plurality of electrically conductive portionsand the electrodesof the semiconductor elementare electrically connected by using wires. The semiconductor element, wiresand electrically conductive portionsare sealed by using a sealing resin. Each of the electrically conductive portionshas overhanging portions, and a side faceof the electrically conductive portionis roughened, thus enhancing the joining strength between each electrically conductive portionand the sealing resin