The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 2009
Filed:
Oct. 18, 2005
Takuya Eto, Ibaraki, JP;
Kazuhiro Ikemura, Ibaraki, JP;
Eiji Toyoda, Ibaraki, JP;
Katsuyuki Nakabayashi, Ibaraki, JP;
Daisuke Tsukahara, Ibaraki, JP;
Takuya Eto, Ibaraki, JP;
Kazuhiro Ikemura, Ibaraki, JP;
Eiji Toyoda, Ibaraki, JP;
Katsuyuki Nakabayashi, Ibaraki, JP;
Daisuke Tsukahara, Ibaraki, JP;
Nitto Denko Corporation, Osaka, JP;
Abstract
An epoxy resin composition for semiconductor encapsulation which does not contain conductive foreign metallic particles having such a size that they cannot be detected and eliminated by the conventional method for eliminating conductive foreign metallic particles. The epoxy resin composition for semiconductor encapsulation comprises the following components (A) to (D). Conductive foreign metallic particles having a size of 20 μm or more are substantially not contained in the aforementioned epoxy resin composition.