The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 11, 2007
Filed:
Dec. 02, 2004
Eiji Toyoda, Ibaraki, JP;
Takeshi Okada, Ibaraki, JP;
Keisuke Yoshikawa, Ibaraki, JP;
Takuya Eto, Ibaraki, JP;
Kazuhiro Ikemura, Ibaraki, JP;
Shinya Akizuki, Ibaraki, JP;
Tsuyoshi Ishizaka, Ibaraki, JP;
Takahiro Uchida, Ibaraki, JP;
Kei Toyota, Ibaraki, JP;
Eiji Toyoda, Ibaraki, JP;
Takeshi Okada, Ibaraki, JP;
Keisuke Yoshikawa, Ibaraki, JP;
Takuya Eto, Ibaraki, JP;
Kazuhiro Ikemura, Ibaraki, JP;
Shinya Akizuki, Ibaraki, JP;
Tsuyoshi Ishizaka, Ibaraki, JP;
Takahiro Uchida, Ibaraki, JP;
Kei Toyota, Ibaraki, JP;
Nitto Denko Corporation, Osaka, JP;
Abstract
A method for producing an epoxy resin composition for semiconductor encapsulation, which does not cause void generation and the like and is excellent in reliability. A method for producing an epoxy resin composition for semiconductor encapsulation, which contains the following components (A) to (C): (A) an epoxy resin, (B) a phenol resin, and (C) a hardening accelerator, which comprises mixing the whole or a part of the components excluding the component (A) among the components containing the components (A) to (C) in advance under a reduced pressure of from 1.333 to 66.65 kPa and under a heating condition of from 100 to 230° C., and then mixing the component (A) and remaining components with the resulting mixture.