The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 20, 2006
Filed:
Feb. 20, 2004
Chikao Ikenaga, Shinjuku-Ku, JP;
You Shimazaki, Shinjuku-Ku, JP;
Masachika Masuda, Shinjuku-Ku, JP;
Kazuhito Hosokawa, Ibaraki, JP;
Takuji Okeyui, Ibaraki, JP;
Keisuke Yoshikawa, Ibaraki, JP;
Kazuhiro Ikemura, Ibaraki, JP;
Chikao Ikenaga, Shinjuku-Ku, JP;
You Shimazaki, Shinjuku-Ku, JP;
Masachika Masuda, Shinjuku-Ku, JP;
Kazuhito Hosokawa, Ibaraki, JP;
Takuji Okeyui, Ibaraki, JP;
Keisuke Yoshikawa, Ibaraki, JP;
Kazuhiro Ikemura, Ibaraki, JP;
Dai Nippon Printing Co., Ltd., Tokyo, JP;
Nitto Denko Corporation, Tokyo, JP;
Abstract
A semiconductor device fabricating method comprises a substrate forming step of forming a plurality of separate conductive padson an adhesive layer included in an adhesive sheet, and a semiconductor chip mounting step of bonding semiconductor chips to the adhesive sheetwith surfaces thereof not provided with any electrodes in contact with the adhesive sheet, and electrically connecting electrodesformed on the semiconductor chipsand upper parts of the conductive padswith wires. The semiconductor chips, the wiresand the conductive padsare sealed in a sealing resin molding, and then the adhesive sheetis separated from the sealing resin molding. Each of the conductive padshas a reduced part, and a jutting partjutting out from the reduced part. The conductive padshaving such construction can be firmly bonded to the sealing resin molding