Company Filing History:
Years Active: 2014-2022
Title: Innovations by Kai-Ming Liu: Pioneering Advances in Semiconductor Technology
Introduction
Kai-Ming Liu, based in Hsinchu, Taiwan, is an accomplished inventor with a notable portfolio of 14 patents in the field of semiconductor technology. His contributions to advancements in package structures and circuit design methodologies have significantly influenced the industry.
Latest Patents
Among his latest innovations is a patent focused on a package structure and the method for forming it. This invention outlines a complex assembly that integrates a die surrounded by a first molding, a redistribution layer (RDL), and an interposer, all of which work in unison to enhance the functionality and efficiency of semiconductor components. Additionally, Liu has developed a layout checking system and method that provides processes for verifying circuit designs through comparisons of layout patterns and coding constraints, streamlining the production of semiconductor devices.
Career Highlights
Kai-Ming Liu is currently associated with Taiwan Semiconductor Manufacturing Company Limited, where he continues to push the boundaries of semiconductor innovation. His prolific patent portfolio demonstrates his commitment to advancing technology and solving intricate challenges within the field. Liu’s inventions not only reflect his technical expertise but also his forward-thinking approach to semiconductor design.
Collaborations
Throughout his career, Liu has collaborated with esteemed colleagues, including Yao-Jen Hsieh and Shih Hsin Chen. These collaborations have further enhanced the innovative output of his work, allowing for cross-pollination of ideas and approaches in semiconductor technology.
Conclusion
Kai-Ming Liu’s impact in the semiconductor industry is marked by his extensive patent collection and his role at Taiwan Semiconductor Manufacturing Company Limited. His innovative patents, including advancements in package structures and layout checking methods, signify his dedication to improving semiconductor technology. Liu’s collaborations exemplify the collaborative spirit prevalent in the field, paving the way for future innovations.