The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2015
Filed:
Dec. 05, 2013
Method and system for checking the inter-chip connectivity of a three-dimensional integrated circuit
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Yao-Jen Hsieh, Taipei, TW;
Kai-Ming Liu, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-chu, TW;
Abstract
A method for checking the inter-chip connectivity of a three-dimensional (3D) integrated circuit (IC) generally comprises receiving a design file for each of a plurality of chips of the 3D IC and generating a plurality of inter-layer ports to be shared between at least two of the of chips based on the design files for each of the chips. A layout without the share ports for each of the chips based on the design files for each of the chips is generated and a layout versus schematic (LVS) check is conducted for each of the generated layouts by using the identified inter-layer ports.