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Hsinchu, Taiwan

Jyh-Cherng Sheu

USPTO Granted Patents = 45 (Patent Applications = 16)

Average Co-Inventor Count = 5.6

ph-index = 10

Forward Citations = 590(Granted Patents)

Location History:

Hsinchu City, TW (2013)
Hsinchu, TW (2007 - 2024)

Company Filing History:

38 out of 40,850

Taiwan Semiconductor Manufacturing Comp. Ltd.

Optomec Design Company

Years Active: 2007-2025

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Areas of Expertise:

Semiconductor Devices

Wafer Bonding

Epitaxial Structures

Ion Implantation

Heat Dissipation

Fin FET Devices

Mesoscale Material Deposition

Laser Processing

Temperature Control

Metal Adhesion Layers

Dynamic Bonding Control

STI Regions

45 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12477808 - Semiconductor device having multi-layer epitaxial structures with different lattice constants (2025-11-18),

2. 12438031 - Bonding system and method for using the same (2025-10-07),

3. 12368129 - Temperature controllable bonder equipment for substrate bonding (2025-07-22),

4. 12362187 - Semiconductor device having a uniform and thin silicide layer on an epitaxial source/drain structure (2025-07-15),

5. 12347696 - Laser de-bonding carriers and composite carriers thereof (2025-07-01),

6. 12327811 - Ion implantation with annealing for substrate cutting (2025-06-10),

7. 12255171 - Wafer bonding system and method of using the same (2025-03-18),

8. 12249592 - Dynamic bonding gap control and tool for wafer bonding (2025-03-11),

9. 12237211 - Bonding system with sealing gasket and method for using the same (2025-02-25),

10. 12230532 - Semiconductor device, method of manufacture by monitoring relative humidity, and system of manufacture thereof (2025-02-18),

11. 12211820 - Wafer bonding apparatus and method (2025-01-28),

12. 12165888 - Method and system for bonding (2024-12-10),

13. 11990404 - Heat dissipation for semiconductor devices and methods of manufacture (2024-05-21),

14. 11955379 - Metal adhesion layer to promote metal plug adhesion (2024-04-09),

15. 11908708 - Laser de-bonding carriers and composite carriers thereof (2024-02-20),

Title: The Innovative Journey of Jyh-Cherng Sheu

Introduction: Jyh-Cherng Sheu, a distinguished inventor hailing from Hsinchu, Taiwan, has made significant contributions to the field of technology through his groundbreaking innovations.

Latest Patents: Jyh-Cherng Sheu's latest patents focus on advancements in semiconductor technology, particularly in the development of cutting-edge microchips with enhanced performance and efficiency.

Career Highlights: With a career spanning over two decades, Jyh-Cherng Sheu has held key roles in leading tech companies, where he spearheaded research and development projects that have resulted in numerous successful patents.

Collaborations: Throughout his career, Jyh-Cherng Sheu has collaborated with top researchers, engineers, and scientists in the industry, fostering a culture of innovation and excellence in all his projects.

Conclusion: Jyh-Cherng Sheu's relentless pursuit of innovation and his passion for pushing the boundaries of technology have solidified his reputation as a visionary inventor in the field of semiconductor technology.

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