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For the Inventor, By the Inventor

Hsinchu, Taiwan

Jyh-Cherng Sheu

This inventor holds 47 USPTO granted patents and 17 published patent applications, primarily in Semiconductor Devices. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Optomec Design Company, Optomec, Inc.. Active years: 2007-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jyh-Cherng Sheu. Retrieved from https://idiyas.com/inventor/jyh-cherng-sheu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 47 

% Patents Active = 78.7

Average Co-Inventor Count = 5.6

ph-index = 10

Forward Citations = 595(Granted Patents)


Location History:

  • Hsinchu City, TW (2013)
  • Hsinchu, TW (2007 - 2024)

Company Filing History:

goldMedal39 out of 42,872 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal5 out of 18 
 
Optomec Design Company
 patents
bronzeMedal2 out of 15 
 
Optomec, Inc.
 patents
4. 1 out of 481 
 
Taiwan Semiconductor Manufacturing Co., Ltd.
 patents

Years Active: 2007-2026

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Areas of Expertise:
Wafer Bonding
Semiconductor Fins
Heat Dissipation
Epitaxial Structures
Bonding Systems
Ion Implantation
Silicide Layers
Dynamic Bonding Control
STI Regions
Loadlock Chamber
Maskless Deposition
Metal Adhesion
47 patents (USPTO):Explore Patents
1. 12599042 - Carrier structure and methods of forming the same (2026-04-07),
2. 12557612 - Bonding system with sealing gasket and method for using the same (2026-02-17),
3. 12477808 - Semiconductor device having multi-layer epitaxial structures with different lattice constants (2025-11-18),
4. 12438031 - Bonding system and method for using the same (2025-10-07),
5. 12368129 - Temperature controllable bonder equipment for substrate bonding (2025-07-22),
6. 12362187 - Semiconductor device having a uniform and thin silicide layer on an epitaxial source/drain structure (2025-07-15),
7. 12347696 - Laser de-bonding carriers and composite carriers thereof (2025-07-01),
8. 12327811 - Ion implantation with annealing for substrate cutting (2025-06-10),
9. 12255171 - Wafer bonding system and method of using the same (2025-03-18),
10. 12249592 - Dynamic bonding gap control and tool for wafer bonding (2025-03-11),
11. 12237211 - Bonding system with sealing gasket and method for using the same (2025-02-25),
12. 12230532 - Semiconductor device, method of manufacture by monitoring relative humidity, and system of manufacture thereof (2025-02-18),
13. 12211820 - Wafer bonding apparatus and method (2025-01-28),
14. 12165888 - Method and system for bonding (2024-12-10),
15. 11990404 - Heat dissipation for semiconductor devices and methods of manufacture (2024-05-21),

Title: The Innovative Journey of Jyh-Cherng Sheu

Introduction: Jyh-Cherng Sheu, a distinguished inventor hailing from Hsinchu, Taiwan, has made significant contributions to the field of technology through his groundbreaking innovations.

Latest Patents: Jyh-Cherng Sheu's latest patents focus on advancements in semiconductor technology, particularly in the development of cutting-edge microchips with enhanced performance and efficiency.

Career Highlights: With a career spanning over two decades, Jyh-Cherng Sheu has held key roles in leading tech companies, where he spearheaded research and development projects that have resulted in numerous successful patents.

Collaborations: Throughout his career, Jyh-Cherng Sheu has collaborated with top researchers, engineers, and scientists in the industry, fostering a culture of innovation and excellence in all his projects.

Conclusion: Jyh-Cherng Sheu's relentless pursuit of innovation and his passion for pushing the boundaries of technology have solidified his reputation as a visionary inventor in the field of semiconductor technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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