The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 10, 2024
Filed:
Nov. 22, 2021
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Chieh Chang, Hsinchu, TW;
Jyh-Cherng Sheu, Hsinchu, TW;
Huicheng Chang, Tainan, TW;
Yee-Chia Yeo, Hsinchu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;
Abstract
A method of forming a semiconductor device includes mounting a first wafer on a first wafer chuck and mounting a second wafer on a second wafer chuck. A push pin is extended through the first wafer chuck to distort the first wafer. A surface profile distortion of the first wafer is measured with a first surface profiler. A vacuum pressure of a vacuum zone on the first wafer chuck is adjusted using a measurement of the surface profile distortion. The first wafer chuck is moved towards the second wafer chuck so that the first wafer physically contacts the second wafer, and the first wafer is bonded to the second wafer.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile