Company Filing History:

9 out of 9

Multiplanar Technologies Incorporated

patents

3 out of 1,530

Mitsubishi Materials Corporation

Multi Planar Technologyies, Inc.

patent

5. 1 out of 832,843

Other

patents

Years Active: 2002-2007

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16 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 7311586 - Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure (2007-12-25),

2. 7118456 - Polishing head, retaining ring for use therewith and method fo polishing a substrate (2006-10-10),

3. 7029382 - Apparatus for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure (2006-04-18),

4. 6966822 - System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control (2005-11-22),

5. 6893327 - Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface (2005-05-17),

6. 6887132 - Slurry distributor for chemical mechanical polishing apparatus and method of using the same (2005-05-03),

7. 6641461 - Chemical mechanical polishing apparatus having edge, center and annular zone control of material removal (2003-11-04),

8. 6623343 - System and method for CMP head having multi-pressure annular zone subcarrier material removal control (2003-09-23),

9. 6558232 - System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control (2003-05-06),

10. 6540590 - Chemical mechanical polishing apparatus and method having a rotating retaining ring (2003-04-01),

11. 6527625 - Chemical mechanical polishing apparatus and method having a soft backed polishing head (2003-03-04),

12. 6508696 - Wafer-polishing head and polishing apparatus having the same (2003-01-21),

13. 6506105 - System and method for pneumatic diaphragm CMP head having separate retaining ring and multi-region wafer pressure control (2003-01-14),

14. 6398906 - Wafer transfer apparatus and wafer polishing apparatus, and method for manufacturing wafer (2002-06-04),

15. 6368189 - Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure (2002-04-09),

Title: Jiro Kajiwara: Innovator in Chemical-Mechanical Polishing Technology

Introduction

Jiro Kajiwara is a prominent inventor based in Cupertino, CA (US), known for his significant contributions to the field of chemical-mechanical polishing (CMP) technology. With a total of 16 patents to his name, Kajiwara has developed innovative solutions that enhance the efficiency and effectiveness of polishing processes in various applications.

Latest Patents

Among his latest patents, Kajiwara has introduced an "Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure." This invention features a resilient pneumatic annular sealing bladder that is coupled for fluid communication to a first pressurized pneumatic fluid, defining a first pneumatic zone. This bladder is attached to the wafer stop plate, supporting the wafer at its peripheral edge during polishing operations. Additionally, he has developed a "Polishing head, retaining ring for use therewith and method for polishing a substrate," which includes a polishing head designed to hold a substrate during polishing. This apparatus incorporates a retaining ring with radial recesses to distribute chemicals effectively, ensuring a uniform polishing surface.

Career Highlights

Kajiwara has worked with notable companies such as Multiplanar Technologies Incorporated and Mitsubishi Materials Corporation. His experience in these organizations has allowed him to refine his expertise in CMP technology and contribute to advancements in the field.

Collaborations

Throughout his career, Kajiwara has collaborated with esteemed colleagues, including Gerard Moloney and Huey-Ming Wang. These partnerships have fostered innovation and the sharing of ideas, further enhancing the development of CMP technologies.

Conclusion

Jiro Kajiwara's work in chemical-mechanical polishing technology has made a lasting impact on the industry. His innovative patents and collaborations with leading professionals highlight his dedication to advancing this critical field.

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