The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 04, 2002
Filed:
Mar. 13, 2000
Applicant:
Inventors:
Assignee:
Mitsubishi Materials Corporation, Tokyo, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 7/00 ;
U.S. Cl.
CPC ...
B24B 7/00 ;
Abstract
The present invention provides a wafer polishing apparatus provided with a platen on the surface of which a polishing pad is affixed, and a wafer holding head for allowing one face of a wafer to contact the polishing pad by holding the wafer to be polished, the wafer being polished by a relative motion between the wafer holding head and the platen, wherein a dress ring is provided with an abrasive grain layer at the lower part at the outside of the wafer holding head so as to be rotatable while being in contact with the surface of the polishing pad.
Quick Actions:
Kobayashi, Tatsunori. (2002). Wafer transfer apparatus and wafer polishing apparatus, and method for manufacturing wafer (U.S. Patent No. 6398906). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6398906
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile