The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 23, 2003
Filed:
May. 11, 2001
Jiro Kajiwara, Cupertino, CA (US);
Gerard S. Moloney, Milpitas, CA (US);
Huey-Ming Wang, Fremont, CA (US);
David A. Hansen, Palo Alto, CA (US);
Alejandro Reyes, San Jose, CA (US);
Multi Planar Technologies, Inc., San Jose, CA (US);
Abstract
An apparatus and method for planarizing a substrate are provided. The apparatus ( ) includes a subcarrier ( ) having an outer surface ( ) with an annular first membrane ( ) coupled thereto. The first membrane ( ) has a receiving surface ( ) adapted to receive the substrate ( ) thereon, and a lip ( ) adapted to seal with a backside of the substrate to define a first chamber ( ) therebetween. A second membrane ( ) positioned above the first membrane ( ), and coupled to the subcarrier ( ) defines a second chamber ( ). During a polishing operation pressurized fluid introduced into the second chamber ( ) causes it to expand outward to exert a force on a portion of the backside of the substrate ( ), thereby pressing a predetermined area ( ) of the surface of the substrate against the polishing pad. The predetermined area ( ) is directly proportional to the pressure of the fluid introduced into the second chamber ( ).