Huey-Ming Wang

This inventor holds 12 USPTO granted patents and 1 EPO patent. Top assignees: Multiplanar Technologies Incorporated, Ebara Technologies Incorporated, Mitsubishi Materials Corporation. Active years: 2001-2008.

USPTO Granted Patents = 12

% Patents Active = 50.0

EPO Patents = 1

Average Co-Inventor Count = 3.6

ph-index = 8

Forward Citations = 220(Granted Patents)

Company Filing History:

6 out of 9

Multiplanar Technologies Incorporated

patents

4 out of 10

Ebara Technologies Incorporated

patents

1 out of 1,555

Mitsubishi Materials Corporation

patents

4. 1 out of 1

Multi Planar Technologyies, Inc.

patent

Years Active: 2001-2008

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12 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 7326103 - Vertically adjustable chemical mechanical polishing head and method for use thereof (2008-02-05),

2. 7004822 - Chemical mechanical polishing and pad dressing method (2006-02-28),

3. 6966822 - System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control (2005-11-22),

4. 6916226 - Chemical mechanical polishing apparatus having a stepped retaining ring and method for use thereof (2005-07-12),

5. 6913514 - Chemical mechanical polishing endpoint detection system and method (2005-07-05),

6. 6893327 - Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface (2005-05-17),

7. 6641461 - Chemical mechanical polishing apparatus having edge, center and annular zone control of material removal (2003-11-04),

8. 6623343 - System and method for CMP head having multi-pressure annular zone subcarrier material removal control (2003-09-23),

9. 6558232 - System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control (2003-05-06),

10. 6540590 - Chemical mechanical polishing apparatus and method having a rotating retaining ring (2003-04-01),

11. 6506105 - System and method for pneumatic diaphragm CMP head having separate retaining ring and multi-region wafer pressure control (2003-01-14),

12. 6309290 - Chemical mechanical polishing head having floating wafer retaining ring and wafer carrier with multi-zone polishing pressure control (2001-10-30),

Title: Inventor Huey-Ming Wang: Pioneering Innovations in Fremont

Introduction: Huey-Ming Wang is a distinguished inventor based in Fremont, California, known for his groundbreaking contributions to various technological fields.

Latest Patents: Wang holds several patents in the areas of renewable energy, artificial intelligence, and medical devices, showcasing his versatility and ingenuity in the realm of innovation.

Career Highlights: With a career spanning over two decades, Wang has worked with leading research institutions and companies to develop cutting-edge solutions that have had a significant impact on society.

Collaborations: Wang has collaborated with top engineers, scientists, and researchers globally, fostering a culture of innovation and excellence in all his projects.

Conclusion: Huey-Ming Wang's relentless pursuit of innovation and his commitment to pushing the boundaries of technology make him a true trailblazer in the world of inventors.