The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 01, 2003
Filed:
Aug. 31, 2000
Jiro Kajiwara, Cupertino, CA (US);
Huey-Ming Wang, Fremont, CA (US);
Multi-Planar Technologies, Inc., San Jose, CA (US);
Abstract
A polishing apparatus ( ) and method for polishing and planarizing a substrate ( ) is provided that achieves a high-planarization uniformity across the substrate. In one embodiment, the polishing head ( ) includes a carrier ( ), a subcarrier ( ) carried by the carrier and adapted to hold the substrate ( ) during a polishing operation and a retaining ring ( ) rotatably disposed about the subcarrier. The retaining ring ( ) has a lower surface ( ) that is substantially flush with the surface of the substrate ( ) and is in contact with a polishing surface ( ) during the polishing operation. The retaining ring ( ) is capable of rotating relative to the substrate ( ) held on the subcarrier ( ) to inhibit non-planar polishing of the surface of the substrate. In another embodiment, the polishing head ( ) further includes a backing ring ( ) in a facing relationship with an upper surface ( ) of the retaining ring ( ) and separated from the retaining ring by a bearing ( ).