The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 17, 2005
Filed:
Jun. 04, 2001
Jiro Kajiwara, Cupertino, CA (US);
Gerard S. Moloney, Milpitas, CA (US);
Huey-ming Wang, Fremont, CA (US);
Junsheng Yang, Sunnyvale, CA (US);
Jiro Kajiwara, Cupertino, CA (US);
Gerard S. Moloney, Milpitas, CA (US);
Huey-Ming Wang, Fremont, CA (US);
Junsheng Yang, Sunnyvale, CA (US);
Multi Planar Technologies, Inc., San Jose, CA (US);
Abstract
A system () and method for polishing and planarizing a substrate () is provided that reduces non-uniformities in the removal of material from the edge of the substrate due to a rebound effect. In one embodiment system () includes a polishing head () having a carrier (), a subcarrier () carried by the carrier and adapted to hold the substrate during a polishing operation, and a retaining ring () having an inner edge () disposed about the subcarrier. A lower surface () of the retaining ring () is in contact with a polishing surface () during the polishing operation, and has at least one annular recess () formed therein to enable the polishing surface compressed under the retaining ring to rebound into the annular recess, thereby reducing the rebound effect and inhibiting non-planar polishing of the surface of the substrate ().