Tokyo, Japan

Jinyan Zhao

USPTO Granted Patents = 14 

Average Co-Inventor Count = 1.5

ph-index = 2

Forward Citations = 10(Granted Patents)


Company Filing History:


Years Active: 2014-2025

where 'Filed Patents' based on already Granted Patents

14 patents (USPTO):

Title: Innovations of Jinyan Zhao

Introduction

Jinyan Zhao is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of engineering, particularly in the area of workpiece processing. With a total of 14 patents to his name, Zhao continues to push the boundaries of innovation.

Latest Patents

Zhao's latest patents include a method of processing a warped workpiece. This method involves a warpage eliminating step that applies a laser beam to the workpiece while positioning a focused spot at a predetermined first position. This process forms modified layers and cracks that eliminate warpage. Another notable patent is a wafer processing method, which includes affixing a wafer to a sheet via a die attach layer and subsequently removing the protruding portion from the sheet.

Career Highlights

Zhao works at Disco Corporation, a company known for its advanced technology in semiconductor manufacturing. His work has been instrumental in developing innovative solutions that enhance the efficiency and effectiveness of wafer processing.

Collaborations

Zhao collaborates with talented individuals such as Shigenori Harada and Yoshiaki Yodo. Their combined expertise contributes to the success of their projects and the advancement of technology in their field.

Conclusion

Jinyan Zhao's contributions to the field of engineering and his innovative patents demonstrate his commitment to advancing technology. His work continues to inspire future generations of inventors and engineers.

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