The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2020
Filed:
Mar. 01, 2019
Applicant:
Disco Corporation, Tokyo, JP;
Inventor:
Jinyan Zhao, Tokyo, JP;
Assignee:
DISCO CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); H01L 21/67092 (2013.01); H01L 21/67115 (2013.01); H01L 21/67132 (2013.01); H01L 21/6836 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68327 (2013.01);
Abstract
A wafer processing method includes a grouping step of dividing a wafer along division lines demarcating a plurality of devices as one block on the wafer to form a plurality of group pieces, a reattaching step of attaching one of the group pieces to an expansion tape, a modified layer forming step of emitting a laser beam having a wavelength transmittable through the wafer along the division lines for each group piece to form modified layers, a dividing step of expanding the expansion tape, and dividing each of the group pieces in which the modified layers are formed into individual devices.