The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 26, 2021
Filed:
Apr. 18, 2019
Applicant:
Disco Corporation, Tokyo, JP;
Inventor:
Jinyan Zhao, Tokyo, JP;
Assignee:
DISCO CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01); H01L 21/304 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); H01L 21/304 (2013.01); H01L 21/67092 (2013.01);
Abstract
A method of processing a wafer with a metal film to divide the wafer into individual device chips along a grid of projected dicing lines where the mechanical strength of the wafer is reduced. The method includes the steps of sticking a holding tape to a face side of the wafer, holding the wafer while a reverse side of the wafer with the metal film thereon is being exposed, and drawing the wafer under suction along the projected dicing lines to fracture the wafer along the projected dicing lines while the reverse side of the wafer is being cooled in its entirety.